Posted inGeneral
K-AIFF 2024: How AI Films Took Center Stage in South Korea
On October 25, 2024, South Korea entered uncharted cinematic territory by hosting its first-ever international…
TCL LINKPORT IK511: Affordable 5G Connectivity With Qualcomm X35
On October 17, 2024, TCL has introduced the TCL LINKPORT IK511, a portable 5G connectivity…
Qualcomm Snapdragon Elite 8 vs. Snapdragon 8 Gen 3: New Oryon CPU, Redesigned AI Engine, GPU and AI ISP, Delivering Top Performance
On October 21, 2024, Qualcomm introduced its latest flagship mobile SoC, the Snapdragon 8 Elite,…
Posted inCEATEC ceatec 2024 General
Unlocking the Invisible with Sony SWIR Image Sensors
Sony’s Short-Wave Infrared (SWIR) image sensors are transforming industries by allowing the detection of materials…
Posted inCEATEC ceatec 2024 General
Mitsubishi Electric TOKUFASTbot: World’s Fastest Puzzle Cube-Solving Robot
TOKUFASTbot made history by solving a puzzle cube in an astounding 0.305 seconds, a feat…
Posted inAugmented Reality (AR) CEATEC ceatec 2024
TDK AR+VR Ring Interface: A Prototype Shows Off Components
The advent of augmented reality (AR) and virtual reality (VR) technologies has transformed how we…
Posted inAugmented Reality (AR) CEATEC ceatec 2024
TDK AR Retinal Glasses Technology Upgraded at CEATEC 2024
At CEATEC 2024 in Tokyo, TDK unveiled its latest hardware components for AR/VR smart glasses,…
Posted inAndroid Dimensity 9300 Dimensity 9400
MediaTek Unveiled The Dimensity 9400 Its Flagship Mobile SoC Featuring Second-Gen “All-Big-Core” CPU Architecture And An Agentic AI-ready NPU
MediaTek has launched its newest flagship mobile System-on-Chip (SoC), the Dimensity 9400, marking a significant…